Copper cladding, the copper foil layers bonded to the PCB substrate, directly influences conductor losses and interactions with the dielectric material. Poor choices in cladding properties can lead to increased signal attenuation, distorting waveforms and reducing system. Copper cladding, also known as copper pour or copper fill, is a fundamental aspect of Printed Circuit Board (PCB) design. This article delves into the. By strategically arranging signal layers, power planes, and ground planes, and using copper cladding effectively, you can enhance signal integrity, ensure impedance matching, and create a robust power distribution network.